gbpc12, 15, 25 and 35 vishay semiconductors formerly general semiconductor document number 88612 www.vishay.com 09-jul-02 1 glass passivated single-phase bridge rectifier reverse voltage 50 and 1000v forward current 12 to 35a mechanical data case: molded plastic with heatsink integrally mounted in the bridge encapsulation terminals: either plated 0.25" (6.35mm) faston lugs or plated copper leads 0.040" (1.02mm) diameter. suffix letter ? added to indicate wire leads (e.g. gbpc12005w) mounting position: see (note 2) polarity: polarity symbols molded on body mounting torque: 20 in. - lb. max. weight: 0.53 ounce, 15 grams packaging codes/options: 1/100 ea. per bulk box features ?plastic package has underwriters laboratory flammability classification 94v-0 ?this series is ul listed under the recognized component index, file number e54214 ?integrally molded heatsink provides very low thermal resistance for maximum heat dissipation ?universal 3-way terminals; snap-on, wire wrap-around, or p.c.b. mounting ?high forward surge current capability ?glass passivated chip junctions ?typical i r less than 0.3 a ?high temperature soldering guaranteed: 260?/10 seconds at 5lbs. (2.3kg) tension 1.135 (28.8) 1.115 (28.3) 0.732 (18.6) 0.692 (17.6) 0.470 (11.9) 0.430 (10.9) 0.042 (1.07) 0.038 (0.97) dia. 0.310 (7.62) 0.290 (7.36) 1.25 (31.8) min. 1.135 (28.8) 1.115 (28.3) 0.732 (18.6) 0.692 (17.6) hole for #10 screw 0.220 (5.59) 0.200 (5.08) dia. 0.24 (6.0) 0.18 (4.6) 0.50 (12.7) 0.44 (11.7) 0.24 (6.0) 0.18 (4.6) gbpc-w 1.135 (28.8) 1.115 (28.3) 0.672 (17.1) 0.632 (16.1) 0.732 (18.6) 0.692 (17.6) 0.094 (2.4) dia. 0.034 (0.86) 0.030 (0.76) 0.25 (6.35) ac 0.840 (21.3) 0.740 (18.8) 0.582 (14.8) 0.542 (13.8) 0.672 (17.1) 0.632 (16.1) 1.135 (28.8) 1.115 (28.3) hole for #10 screw 0.220 (5.59) 0.200 (5.08) dia. 0.310 (7.62) 0.290 (7.36) gbpc dimensions in inches and (millimeters)
gbpc12, 15, 25 and 35 vishay semiconductors formerly general semiconductor www.vishay.com document number 88612 2 09-jul-02 maximum ratings and thermal characteristics (t a = 25? unless otherwise noted) gbpc12, 15, 25, 35 symbols 005 01 02 04 06 08 10 units maximum repetitive peak reverse voltage v rrm 50 100 200 400 600 800 1000 v maximum rms voltage v rms 35 70 140 280 420 560 700 v maximum dc blocking voltage v dc 50 100 200 400 600 800 1000 v maximum average forward gbpc12 12 rectified output current gbpc15 i f(av) 15 a (see fig.1) gbpc25 25 gbpc35 35 peak forward surge current single gbpc12 200 sine-wave superimposed on gbpc15 i fsm 300 a rated load (jedec method) gbpc25 300 gbpc35 400 rating (non-repetitive, for t gbpc12 160 greater than 1ms and less gbpc15 i 2 t 375 a 2 sec than 8.3ms) for fusing gbpc25 375 gbpc35 660 rms isolation voltage from case to leads v iso 2500 v typical thermal resistance per leg (1) gbpc12-25 r jc 1.9 ?/w gbpc35 1.4 operating junction storage temperature range t j , t stg -55 to +150 ? electrical characteristics ratings at 25? ambient temperature unless otherwise specified. gbpc12, 15, 25, 35 symbols 005 01 02 04 06 08 10 units maximum instantaneous gbpc12 i f =6.0a forward voltage drop per gbpc15 i f =7.5a v f 1.1 v leg at gbpc25 i f =12.5a gbpc35 i f =17.5a maximum reverse dc current at rated t a =25? 5.0 dc blocking voltage per leg t a =125? i r 500 a typical junction capacitance per leg at 4v, 1mh z c j 300 pf notes: (1) thermal resistance from junction to case per leg (2) bolt down on heatsink with silicone thermal compound between bridge and mounting surface for maximum heat transfer with #10 screw
gbpc12, 15, 25 and 35 vishay semiconductors formerly general semiconductor document number 88612 www.vishay.com 09-jul-02 3 ratings and characteristic curves (t a = 25? unless otherwise noted) case temperature ( c) fig. 1 ? maximum output rectified current average forward current (a) fig. 3 ? maximum power dissipation average output current (a) average power dissipation of bridge (w) number of cycles at 60 h z peak forward surge current (a) fig. 4 ? maximum non-repetitive peak forward surge current per leg ambient temperature ( c) fig. 2 ? maximum output rectified current average forward current (a) 0 25 50 75 100 125 150 175 200 0 5 10 15 20 25 30 35 40 bridges mounted on 9.5 x 3.5 x 4.6" (22.9 x 8.9 x 11.7cm) al. finned plate 5 x 6 x 4.9" al, finned plate 5 x 4 x 3" al. finned plate 6 x 2.2 x 2.2" al. finned plate 0 10 20 30 40 50 60 70 80 90 100 0 5 10 15 20 25 30 35 40 60 h z resistive or inductive load gbpc35 rths-a = 0.5 c/w gbpc25 rths-a = 0.5 c/w gbpc15 rths-a = 1.0 c/w gbpc12 rths-a = 1.0 c/w 0 10 20 30 40 0 10 20 30 40 50 60 70 80 capacitive load t j = t j max. resistive or inductive load 1 10 100 100 500 1.0 cycle gbpc35 t j = t j max. 0.5 single sine-wave (jedec method) gbpc15 gbpc25 gbpc12 60 h z resistive or inductive load
gbpc12, 15, 25 and 35 vishay semiconductors formerly general semiconductor www.vishay.com document number 88612 4 09-jul-02 ratings and characteristic curves (t a = 25 c unless otherwise noted) fig. 5 ? typical instantaneous forward characteristics per leg instantaneous forward voltage (v) instantaneous forward current (a) percent of rated peak reverse voltage (%) instantaneous reverse leakage current ( a) fig. 6 ? typical reverse leakage characteristics per leg fig. 8 ? typical transient thermal impedance per leg t, heating time (sec.) reverse voltage (v) junction capacitance (pf) transient thermal impedance ( cw) fig. 7 ? typical junction capacitance per leg 0.01 0.1 1 10 100 1 10 100 1,000 0.4 0.6 0.8 1 1.2 1.4 1.6 0.01 0.1 1 10 100 t j = 25 c pulse width = 300 s 1% duty cycle 0 20 40 60 80 100 0.01 0.1 1 10 100 50 - 400v 600 - 1000v 1 10 100 50 100 600 t j = 25 c f = 1.0mh z vsig = 50mvp-p t j = 25 c f = 1.0mh z vsig = 50mvp-p t j = 150 c t j = 125 c t j = 25 c
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